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Dual Channel, High Speed Optocouplers Technical Data
HCPL-2530 HCPL-2531 HCPL-4534 HCPL-0530 HCPL-0531 HCPL-0534
Features
* 15 kV/s Minimum Common Mode Transient Immunity at VCM = 1500 V (HCPL-4534/0534) * High Speed: 1 Mb/s * TTL Compatible * Available in 8 Pin DIP, SO-8, and 8 Pin DIP - Gull Wing Surface Mount (Option 020) Packages * High Density Packaging * 3 MHz Bandwidth * Open Collector Outputs * Guaranteed Performance from 0C to 70C * Safety Approval UL Recognized - 2500 V rms for 1 minute (5000 V rms for 1 minute for Option 020) per UL1577 CSA Approved * Single Channel Version Available (4502/3, 0452/3) * MIL-STD-1772 Version Available (55XX/65XX/4N55)
Applications
* Line Receivers - High Common Mode Transient Immunity (>1000 V/s) and Low Input-Output Capacitance (0.6 pF) * High Speed Logic Ground Isolation - TTL/TTL, TTL/ LTTL, TTL/CMOS, TTL/LSTTL * Replace Pulse Transformers - Save Board Space and Weight * Analog Signal Ground Isolation - Integrated Photon Detector Provides Improved Linearity over Phototransistor Type * Polarity Sensing * Isolated Analog Amplifier - Dual Channel Packaging Enhances Thermal Tracking
Description
These dual channel optocouplers contain a pair of light emitting diodes and integrated photodetectors with electrical insulation between input and output. Separate connection for the photodiode bias and output transistor collectors increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the basecollector capacitance.
Functional Diagram
ANODE 1 1 CATHODE 1 2 CATHODE 2 3 ANODE 2 4 8 VCC 7 VO1 6 VO2 5 GND TRUTH TABLE (POSITIVE LOGIC) LED VO ON LOW OFF HIGH
A 0.1 F bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
These dual channel optocouplers are available in an 8 Pin DIP and in an industry standard SO-8 package. The following is a cross reference table listing the 8 Pin DIP part number and the electrically equivalent SO-8 part number. SO-8 Package HCPL-0530 HCPL-0531 HCPL-0534
The SO-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCPL-2530/0530 is for use in TTL/CMOS, TTL/LSTTL or wide bandwidth analog applications. Current transfer ratio (CTR) for the HCPL-2530/0530 is 7% minimum at IF = 16 mA.
The HCPL-2531/0531 is designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 k pull-up resistor. CTR of the HCPL-2531/0531 is 19% minimum at IF = 16 mA. The HCPL-4534/0534 is an HCPL-2531/0531 with increased common mode transient immunity of 15,000 V/s minimum at VCM = 1500 V guaranteed.
8 Pin DIP HCPL-2530 HCPL-2531 HCPL-4534
Selection Guide
Minimum CMR dV/dt (V/s) 1,000 VCM (V) 10 Current Transfer Ratio (%) 7 19 19 9 8-pin DIP (300 Mil) Dual Channel Package HCPL-2530 HCPL-2531 HCPL-4534 Single Channel Package* 6N135 6N136 HCPL-4502 HCPL-4503 Small-Outline SO-8 Dual Channel Package HCPL-0530 HCPL-0531 HCPL-0534 Single Channel Package* HCPL-0500 HCPL-0501 HCPL-0452 HCPL-0453 Widebody (400 Mil) Single Channel Package* HCNW135 HCNW136 HCNW4502 HCNW4503 Hermetic Single and Dual Channel Packages*
15,000 1,000
1500 10
HCPL-55XX HCPL-65XX 4N55
*Technical data for these products are on separate HP publications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired). Example: HCPL-2531#XXX 020 = UL 5000 V rms/1 Minute Option* 300 = Gull Wing Surface Mount Option 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information.
*For HCPL-2530/1 and HCPL-4534 only. Gull wing surface mount option applies to through hole parts only.
Schematic
1 + VF1 - 2 I F1 ICC 8
VCC
I O1 7
VO1
3 - VF2 + 4
I F2 I O2 6 VO2
GND 5 HCPL-4534/0534 SHIELD USE OF A 0.1 F BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED.
4
Package Outline Drawings
8-Pin DIP Package (HCPL-2530/2531/4534)
9.65 0.25 (0.380 0.010) TYPE NUMBER 8 7 6 5 7.62 0.25 (0.300 0.010) 6.35 0.25 (0.250 0.010)
OPTION CODE* DATE CODE
HP XXXXZ YYWW RU 1 1.19 (0.047) MAX. 2 3 4
UL RECOGNITION
1.78 (0.070) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002)
5 TYP. 4.70 (0.185) MAX.
0.51 (0.020) MIN. 2.92 (0.115) MIN.
1.080 0.320 (0.043 0.013)
0.65 (0.025) MAX. 2.54 0.25 (0.100 0.010) DIMENSIONS IN MILLIMETERS AND (INCHES). * MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534)
PAD LOCATION (FOR REFERENCE ONLY) 9.65 0.25 (0.380 0.010)
8 7 6 5
1.016 (0.040) 1.194 (0.047)
4.826 TYP. (0.190) 6.350 0.25 (0.250 0.010) 9.398 (0.370) 9.906 (0.390)
1
2
3
4
1.194 (0.047) 1.778 (0.070) 1.780 (0.070) MAX. 9.65 0.25 (0.380 0.010) 7.62 0.25 (0.300 0.010)
0.381 (0.015) 0.635 (0.025)
1.19 (0.047) MAX.
4.19 MAX. (0.165)
+ 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002)
1.080 0.320 (0.043 0.013) 0.635 0.130 2.54 (0.025 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 0.25 (0.025 0.010)
12 NOM.
5
Small Outline SO-8 Package (HCPL-0530/0531/0534)
8 7 6 5
3.937 0.127 (0.155 0.005)
XXX YWW
5.994 0.203 (0.236 0.008) TYPE NUMBER (LAST 3 DIGITS) DATE CODE
4
PIN ONE 1 0.406 0.076 (0.016 0.003)
2
3
1.270 BSG (0.050) * 5.080 0.127 (0.200 0.005) 7 0.432 (0.017)
45 X
3.175 0.127 (0.125 0.005)
0 ~ 7 1.524 (0.060) 0.203 0.102 (0.008 0.004)
0.228 0.025 (0.009 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 0.254 (0.205 0.010) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN. (0.012)
Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface Mount Option Parts)
260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 T = 145C, 1C/SEC T = 115C, 0.3C/SEC
TEMPERATURE - C
T = 100C, 1.5C/SEC
1
2
3
4
5
6
7
8
9
10
11
12
TIME - MINUTES
Note: Use of nonchlorine activiated fluxes is highly recommended.
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL Recognized under UL 1577, Component Recognition Program, File E55361.
CSA Approved under CSA Component Acceptance Notice #5, File CA 88324.
6
Insulation and Safety Related Specifications
8-Pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9
Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Minimum Internal Tracking (Internal Creepage) Tracking Resistance (Comparative Tracking Index) Isolation Group
Symbol L(101)
L(102)
7.4
4.8
Units Conditions mm Measured from input terminals to output to to output terminals, shortest distance through air. mm Measured from input terminals to output terminals, shortest distance path along body. mm Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Measured from input terminals to output terminals, along internal cavity. DIN IEC 112/VDE 0303 Part 1
0.08
0.08
NA
NA
mm
CTI
200
200
Volts
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter Storage Temperature Operating Temperature Average Forward Input Current (each channel) Peak Forward Input Current (each channel) (50% duty cycle, 1 ms pulse width) Peak Transient Input Current (each channel) ( 1 s pulse width, 300 pps) Reverse LED Input Voltage (each channel) Input Power Dissipation (each channel) Average Output Current (each channel) Peak Output Current Supply Voltage (Pin 8-5) Output Voltage (Pins 7-5, 6-5) Output Power Dissipation (each channel) Lead Solder Temperature (Through-Hole Parts Only) 1.6 mm below seating plane, 10 seconds Reflow Temperature Profile Symbol TS TA IF(AVG) IF(PEAK) IF(TRANS) VR PIN IO(AVG) IO(PEAK) VCC VO PO Device Min. -55 -55 Max. 125 100 25 50 1 5 45 8 16 30 20 35 Units C C mA mA A V mW mA mA V V mW Note
-0.5 -0.5
13
TLS TRP
8 Pin DIP SO-8 and Option 300
260 C See Package Outline Drawings section
7
Electrical Specifications (DC)
Over recommended temperature (TA = 0C to 70C) unless otherwise specified. See note 9.
Parameter Current Transfer Ratio Sym. CTR Device HCPL-2530/ 0530 HCPL-2531/ 0531 HCPL-4534/ 0534 Logic Low Output Voltage VOL HCPL-2530/ 0530 HCPL-2531/ 0531 HCPL-4534/ 0534 Logic High Output Current IOH Min. Typ.* Max. Units 7 5 19 15 0.1 0.5 0.5 0.1 0.5 0.5 0.003 0.5 A V V TA = 25C IO = 1.1 mA IF = 16 mA, VCC = 4.5 V IO = 0.8 mA TA = 25C IO = 3.0 mA IO = 2.4 mA TA = 25C VO = Open IF = 0 mA VCC = 5.5 V TA = 25C VO = Open VCC = 15.0 V A IF = 16 mA, VO = Open, VCC = 15 V IF = 0 mA, VO = Open, VCC = 15 V TA = 25C IF = 16 mA 1.8 BVR 5 V IR =10 A 1 3 1 6 1 1 1 24 50 % TA = 25C 18 50 % Test Conditions TA = 25C Fig. Note 1, 2
IF = 16 mA, 1, 2 VCC = 4.5 V 4 VO = 0.5 V
50 Logic Low Supply Current Logic High Supply Current Input Forward Voltage Input Reverse Breakdown Voltage Temperature Coefficient of Forward Voltage Input Capacitance ICCL 100 400
ICCH
0.05
4
A
VF
1.5
1.7
V
VF TA
-1.6
mV/ C
IF = 16 mA
CIN
60
pF
f = 1 MHz, VF = 0 V
1
*All typicals at TA = 25C.
8
Switching Specifications (AC)
Over recommended temperature (TA = 0C to 70C), VCC = 5 V, IF = 16 mA unless otherwise specified. Device Parameter Sym. HCPLMin. Typ.* Max. Units Test Conditions Fig. Propagation tPHL 2530/0530 0.2 1.5 s TA = 25C RL = 4.1 k 5, 9, Delay Time 2.0 11 to Logic Low 2531/0531/ 0.2 0.8 TA = 25C RL = 1.9 k at Output 4534/0534 1.0 Propagation tPLH 2530/0530 1.3 1.5 s TA = 25C RL = 4.1 k 5, 9, Delay Time 2.0 11 High to Logic 2531/0531/ 0.6 0.8 TA = 25C RL = 1.9 k at Output 4534/0534 1.0 Common |CMH| 2530/0530 1 10 kV/s RL = 4.1 k IF = 0 mA, 10 Mode Transient 2531/0531 1 10 RL = 1.9 k TA = 25C, Immunity at 4534/0534 15 30 RL = 1.9 k VCM = 10 Vp-p Logic High Level Output Common |CML| 2530/0530 1 10 kV/s RL = 4.1 k IF = 0 mA, 10 Mode Transient 2531/0531 1 10 RL = 1.9 k TA = 25C, Immunity at 4534/0534 15 30 RL = 1.9 k VCM = 10 Vp-p Logic Low Level Output Bandwidth BW 3 MHz RL = 100 k 7, 8
*All typicals at TA = 25C.
Note 6, 7
6, 7
5, 6, 7
5, 6, 7
Package Characteristics
Parameter Input-Output Momentary Withstand Voltage** Resistance (Input-Output) Capacitance (Input-Output) Input-Input Insulation Leakage Current Resistance (Input-Input) Capacitance (Input-Input) Sym. VISO Device HCPL-2530/ 2531/4534 Option 020 RI-O CI-O II-I RI-I CI-I HCPL-2530/ 2531/4534 HCPL-0530/ 0531/0534 Min. Typ.* Max. 2500 5000 Units V rms Test Conditions RH < 50%, t = 1 min., Fig. Note 3, 10 3, 11
1012
0.6 0.005
pF A pF
RH 45% VI-O = 500 Vdc, t=5s f = 1 MHz, TA = 25C RH 45%, t = 5 s, VI-I = 500 Vdc
3
12 4
1011 0.03 0.25
4 f = 1 MHz 4
*All typicals at TA = 25C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage," publication number 5963-2203E.
9
Notes: 1. Each channel. 2. CURRENT TRANSFER RATIO is defined as the ratio of output collector current, IO, to the forward LED input current, IF , times 100%. 3. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together. 4. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. 5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the rising edge of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e.,
6.
7.
8.
9.
VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dV /dt on the falling edge of the CM common mode pulse signal, VCM , to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). The 1.9 k load represents 1 TTL unit load of 1.6 mA and the 5.6 k pull-up resistor. The 4.1 k load represents 1 LSTTL unit load of 0.36 mA and the 6.1 k pull-up resistor. The frequency at which the ac output voltage is 3 dB below the low frequency asymptote. Use of a 0.1 F bypass capacitor connected between pins 5 and 8 is recommended.
10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V rms for 1 second (leakage detection current limit, II-O 5 A). 11. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 6000 V rms for 1 second (leakage detection current limit, II-O 5 A). 12. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 13. Derate linearly above 90C free-air temperature at a rate of 3.0 mW/ C for the SOIC-8 package.
NORMALIZED CURRENT TRANSFER RATIO
IO - OUTPUT CURRENT - mA
35 mA 30 mA 25 mA
IF - FORWARD CURRENT - mA
TA = 25C 10 VCC = 5.0 V
40 mA
1.5 HCPL-2530/0530 HCPL-2531/0531/4534/0534
1000 100 10 1.0 0.1 0.01 0.001 1.1
IF + VF -
TA = 25C
1.0
5
20 mA 15 mA 10 mA IF = 5 mA
0.5
0
0.1 0 1
NORMALIZED I F = 16 mA VO = 0.5 V VCC = 5 V TA = 25C 10 100
0
10 VO - OUTPUT VOLTAGE - V
20
1.2
1.3
1.4
1.5
1.6
IF - INPUT CURRENT - mA
VF - FORWARD VOLTAGE - VOLTS
Figure 1. DC and Pulsed Transfer Characteristics.
Figure 2. Current Transfer Ratio vs. Input Current.
Figure 3. Input Current vs. Forward Voltage.
10
NORMALIZED CURRENT TRANSFER RATIO
IOH - LOGIC HIGH OUTPUT CURRENT - nA
1.1
t P - PROPAGATION DELAY - ns
2000
1.0
1500
I F = 16 mA, V CC = 5.0 V HCPL-2530/0530 (R L = 4.1 k) HCPL-2531/0531/4534/0534 (R L = 1.9 k)
10+4 10+3 10+2 10+1 10 0 10 -1 10 -2 -50
IF = 0 VO = VCC = 5.0 V
0.9 NORMALIZED IF = 16 mA VO = 0.5 V VCC = 5 V TA = 25C HCPL-2530/0530 HCPL-2531/0531/4534/0534 0 20 40 60 80 100
1000 t PLH 500 t PHL
0.8
0.7
0.6 -60 -40 -20
0 -60
-20
20
60
100
-25
0
+25
+50
+75
+100
TA - TEMPERATURE - C
TA - TEMPERATURE - C
TA - TEMPERATURE - C
Figure 4. Current Transfer Ratio vs. Temperature.
Figure 5. Propagation Delay vs. Temperature.
Figure 6. Logic High Output Current vs. Temperature.
IO I F - SMALL SIGNAL CURRENT TRANSFER RATIO
0.30
0
NORMALIZED RESPONSE -dB
TA = 25C, RL = 100 , VCC = 5 V
-5 -10 -15 -20 -25
TA = 25C IF = 16 mA RL = 100 RL = 220 RL = 470 RL = 1 k
0.20
0.10
0 0 4 8 12 16 20 24 IF - QUIESCENT INPUT CURRENT - mA +5 V SET I F AC INPUT 0.1 F 560
-30 0.01
0.1
1.0
10
f - FREQUENCY - MHz
Figure 7. Small-Signal Current Transfer Ratio vs. Quiescent Input Current.
1 20 k
2N3053
8 7 6 0.1 F 5 RL
+5 V
2 3 4
100
VO
1.6 V dc 0.25 Vp-p ac
Figure 8. Frequency Response.
11
IF 0 VO 1.5 V 5V
PULSE GEN. ZO = 50 t r = 5 ns
IF 1 2 8 7 6 0.1F 4 RM 5 CL = 1.5 pF RL VO +5 V
10% DUTY CYCLE 1/f < 100 s 3
1.5 V VOL I F MONITOR
t PHL
t PLH
Figure 9. Switching Test Circuit.
B IF A
1 2
8 7 6
0.1 F RL
+5 V
VCM 0V 10% tr VO
90% 90%
10% tf 5V V FF
3 4
VO
5
SWITCH AT A: I F = 0 mA VO SWITCH AT B: I F = 16 mA VOL + VCM -
PULSE GEN.
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
3.0
tP - PROPAGATION DELAY - s
2.0
I F = 10 mA I F = 16 mA VCC = 5.0 V TA = 25 C
1.0 0.8 0.6 0.4
tPLH
t PHL
0.2 0.1 1
2
3
4
5
6 7 8 9 10
RL - LOAD RESISTANCE - k
Figure 11. Propagation Delay Time vs. Load Resistance.
www.hp.com/go/isolator For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright (c) 1998 Hewlett-Packard Co. Obsoletes 5966-1272E Printed in U.S.A. 5968-1090E (7/98)

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